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Processing


Serial number Project Processing capacity
1
NO.OF LAYER
1~6
2
DIELECTRIC MATERIAL

CEM-1

FR4 (130℃ Tg)

AL

3
FINISHED BOARD SIZE (MAX)

23″×41″

(584mm×1041mm)
4
FINISHED BOARD SIZE (MIN)

0.5″×1″

(12.5mm×25mm)
5
BOARD THICKNESS

0.016″~0.945″

(0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4mm)

6

FINISHED BOARD THICKNESS TOLERANCE

(BOARD THICKNESS≥0.8mm)
±10%
7

FINISHED BOARD THICKNESS TOLERANCE (0.4mm

≤BOARD THICKNESS < 0.8mm)
±4mil(±0.1mm)
8
DRILL HOLE DIAMETER (MAX)
0.256″ (6.5mm)
9
DRILL HOLE DIAMETER (MIN)
0.0118″(0.30mm)
10
OUTER LAYER BASE COPPER THICKNESS (MIN)
1/3 OZ (0.012mm)
11
OUTER LAYER BASE COPPER THICKNESS (MAX)
2 OZ (0.105mm)
12
INNER LAYER BASE COPPER THICKNESS (MAX)
1/2 OZ (0.017mm)
13
HOLE DIAMETER TOLERANCE (PTH)
±3mil(±0.076mm)
14
HOLE DIAMETER TOLERANCE (NPTH)
±2mil(±0.051mm)
15

OUTER LAYER DESIGN LINE WIDTH/SPACING

(MIN)

1/1 OZ 6mil/6mil

2/2 OZ 7mil/7mil
16

INNER LAYER DESIGN LINE WIDTH/SPACING

(MIN)
H/HOZ 4mil/4mil
17
TOLERANCE AFTER ETCH
±20%
18
SOLDERMASK REGISTRATION
±2mil
19
SOLDERMASK THICKNESS (MIN)
10μm
20
SOLDERMASK DAM (MIN)
4mil(1mm)
21
NICKEL THICKNESS FOR ELECTROLESS NICKEL AND IMMERSION GOLD
120μin(3.0μm)
22
GOLD THICKNESS FOR ELECTROLESS NICKEL AND IMMERSION GOLD
4μin(0.1μm)
23
SOLDER THICKNESS ON PADS EXCEPT XFP.(MIN)
40μin(1.0μm)
24
SOLDER THICKNESS ON XFP (HAL) (MAX)
100μin(2.54μm)
25
ROUTING DIMENSION TOLERANCE
±6mil (±0.15mm)
26
SLOT WIDTH (MIN)
30mil (0.8mm)
27
BOARD THICKNESS THAT CAN BE V-CUT (MIN)
24mil (0.6mm)

 

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